Copper foil is used as the substrate, and the surface of the copper foil is first pretreated. Using self-developed nickel plating technology, ultrafine grains and an ultra smooth metal nickel layer are deposited outside the copper layer. It has low impedance, good electromagnetic wave shielding performance and conductive grounding performance, excellent flexibility and compliance, good affinity for adhesive, and high adhesion. Good die-cutting performance, no burrs, easy to process.

Widely used in mobile communication, aerospace, and medical equipment. In the field of electronic industry, this product can be used as internal structural components of electronic products such as mobile phones, tablets, laptops, televisions, monitors, etc.

It is based on nickel plating on copper foil and uses vacuum magnetron sputtering to deposit gold. It has the characteristics of light, thin, flexible, high conductivity, good stability, high weldability, high oxidation resistance, and high temperature resistance.